JPS6234444Y2 - - Google Patents

Info

Publication number
JPS6234444Y2
JPS6234444Y2 JP1983016685U JP1668583U JPS6234444Y2 JP S6234444 Y2 JPS6234444 Y2 JP S6234444Y2 JP 1983016685 U JP1983016685 U JP 1983016685U JP 1668583 U JP1668583 U JP 1668583U JP S6234444 Y2 JPS6234444 Y2 JP S6234444Y2
Authority
JP
Japan
Prior art keywords
chuck stage
stage
cutting
base sheet
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983016685U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59123340U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1668583U priority Critical patent/JPS59123340U/ja
Publication of JPS59123340U publication Critical patent/JPS59123340U/ja
Application granted granted Critical
Publication of JPS6234444Y2 publication Critical patent/JPS6234444Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Photographic Processing Devices Using Wet Methods (AREA)
  • Jigs For Machine Tools (AREA)
JP1668583U 1983-02-09 1983-02-09 断裁用チヤツクステ−ジ Granted JPS59123340U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1668583U JPS59123340U (ja) 1983-02-09 1983-02-09 断裁用チヤツクステ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1668583U JPS59123340U (ja) 1983-02-09 1983-02-09 断裁用チヤツクステ−ジ

Publications (2)

Publication Number Publication Date
JPS59123340U JPS59123340U (ja) 1984-08-20
JPS6234444Y2 true JPS6234444Y2 (en]) 1987-09-02

Family

ID=30147955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1668583U Granted JPS59123340U (ja) 1983-02-09 1983-02-09 断裁用チヤツクステ−ジ

Country Status (1)

Country Link
JP (1) JPS59123340U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI689376B (zh) * 2015-04-14 2020-04-01 日商迪思科股份有限公司 切割盤

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007650A (ja) * 2001-06-19 2003-01-10 Tokyo Seimitsu Co Ltd ダイシングマシン
JP5025282B2 (ja) * 2007-02-21 2012-09-12 株式会社ディスコ フレームクランプ装置および切削装置
JP6625397B2 (ja) * 2015-10-26 2019-12-25 株式会社ディスコ バイト切削装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3226681A1 (de) * 1982-07-16 1984-01-19 Hoechst Ag, 6230 Frankfurt Waessrige polyvinylester-dispersion, verfahren zu ihrer herstellung und ihre verwendung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI689376B (zh) * 2015-04-14 2020-04-01 日商迪思科股份有限公司 切割盤

Also Published As

Publication number Publication date
JPS59123340U (ja) 1984-08-20

Similar Documents

Publication Publication Date Title
US5827394A (en) Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing
TW569355B (en) Ablation means for adhesive tape, ablation device for adhesive tape, ablation method for adhesive tape, pick-up device for semiconductor chip, pick-up method for semiconductor chips, manufacturing method and device for semiconductor device
US6767803B2 (en) Method for peeling protective sheet
US5029418A (en) Sawing method for substrate cutting operations
GB2219135A (en) Method and apparatus for removing circuit chips from wafer handling tape
JP2002076096A (ja) 半導体素子のピックアップ方法
KR19990077855A (ko) 다이싱을 위한 네스트와 이에 사용되는 테이프리스 기판을 컷팅하기 위한 방법 및 장치
JP2001093864A (ja) 半導体ウェーハ固定治具及び半導体装置の製造方法
JPS61145839A (ja) 半導体ウエ−ハの接着方法および接着治具
JP2003229469A (ja) 半導体チップピックアップ装置
JPS6234444Y2 (en])
US7498236B2 (en) Silicon wafer thinning end point method
JPH02130103A (ja) ダイシング用治具
JP2002353296A (ja) ウェハの保護テープ剥離装置およびウェハのマウント装置
US20040175903A1 (en) Semiconductor device fabrication method
JPH03101128A (ja) 半導体チップの製造方法
JP2003086540A (ja) 半導体装置の製造方法及びその製造装置
JPS63136527A (ja) 半導体基板処理用粘着シ−ト
JP2814176B2 (ja) 半導体ウェーハの分割方法
KR200363934Y1 (ko) 다이 본더의 백업 홀더 구조
JPS61222146A (ja) 半導体ウエハ支持装置
JPH11151661A (ja) 接着テープ付き研磨パッド及び研磨パッド接着方法
JPH01205441A (ja) 半導体素子ウェハーの切削分割装置用ステージ
JP2007158124A (ja) サポートプレート及びサポートプレートの貼り合わせ方法
JP2004186255A (ja) 薄膜構造体形成基板のダイシング方法